Languages
潘德樟
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
回焊溫度曲線斜率對QFP構裝中脫層之影響研究 = The study of the-Effect of the Temperature Profile on Delamination in QFP Packaging
by:
國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 潘德樟
(Language materials, printed)
, [撰]