張文尚

Overview

Works:	0 works in 1 publications in 1 languages

Titles

方型扁平式封裝中晶片尺寸對表面脫層影響之研究 = The Influence of the Die Size on Delamination for Quad Flat Package by: 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 張文尚 (Language materials, printed) , [撰]

Subjects