林弘政

Overview

Works:	2 works in 1 publications in 1 languages

Titles

錫球陣列封裝基材銅面與防銲綠漆之結合力研究 = The Study of Adhesion Between Solder Mask and Copper Surface of Ball Grid Array Substrate by: 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 林弘政 (Language materials, printed) , [撰]

Subjects