語系
書封
跳至 : 概要 | 書目資訊 | 主題

Lau, John H.

概要
作品: 1 作品在 8 項出版品 1 種語言
書目資訊
Chip scale package (CSP) :design, materials, processes, reliability, and applications / by: Lau, John H.; Lee, Shi-Wei Ricky. (書目-語言資料,印刷品)
Low cost flip chip technologies :for DCA, WLCSP, and PBGA assemblies / by: Lau, John H. (書目-語言資料,印刷品)
Flip chip, hybrid bonding, fan-in, and fan-out technology by: Lau, John H.; SpringerLink (Online service) (書目-電子資源)
Ball grid array technology / by: Lau, John H. (書目-語言資料,印刷品)
Chiplet design and heterogeneous integration packaging by: Lau, John H.; SpringerLink (Online service) (書目-電子資源)
Advanced MEMS packaging by: Lau, John H. (書目-電子資源)
Semiconductor advanced packaging by: Lau, John H.; SpringerLink (Online service) (書目-電子資源)
Heterogeneous integrations by: Lau, John H.; SpringerLink (Online service) (書目-電子資源)
Assembly and reliability of lead-free solder joints by: Lau, John H.; Lee, Ning-Cheng.; SpringerLink (Online service) (書目-電子資源)
更多
 
 
變更密碼
登入