Languages
Wong, C.P.
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
Materials for advanced packaging
by:
Lu, Daniel.; SpringerLink (Online service); Wong, C.P.
(Electronic resources)
Materials for advanced packaging
by:
Lu, Daniel.; SpringerLink (Online service); Wong, C.P.
(Electronic resources)
Nano-bio-electronic, photonic and MEMS packaging
by:
Li, Yi.; Moon, Kyoung-Sik (Jack).; SpringerLink (Online service); Wong, C.P.
(Electronic resources)
Subjects
Nanostructured materials.
Chemistry.
Biophysics and Biological Physics.
Nanotechnology.
Bioelectronics.
Biomedical Engineering.
Material Science.
Electronics and Microelectronics, Instrumentation.
Nanophotonics.
Packaging
Electrochemistry.
Circuits and Systems.
Metallic Materials.
Electronic packaging.
Nanotechnology and Microengineering.
Microelectronic packaging.
Optical and Electronic Materials.
Engineering.