王保揚

Overview

Works:	2 works in 1 publications in 1 languages

Titles

凸塊迴焊製程技術之錫球孔洞改進研究 = The Study of the Bump Void Improvement for Solder Bump Reflow Process by: 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 王保揚 (Language materials, printed) , [撰]

Subjects