高灃

電鍍添加劑濃度對增層法製程凸點及短路改善之研究 = The Improvement of Plating Nodules, Whiskers, and Short Defects in Substrate Plating Process by Controlling the Concentration of Plating Addition. by: 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 高灃 (書目-語言資料,印刷品) , [撰]