李明勳

Overview

Works:	1 works in 1 publications in 1 languages

Titles

IC封裝中環氧樹脂對封模線偏移的影響 = Study of Epoxy on Molding Wire Sweep in IC Package by: 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 李明勳 (Language materials, printed) , [撰]

Subjects