Languages
林宣甫
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
晶圓級封裝產品之晶背研磨參數研究 = Study of Wafer Backside Grinding for WLCSP Product
by:
國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 林宣甫
(Language materials, printed)
, [撰]
Subjects