劉賢民

Overview

Works:	1 works in 1 publications in 1 languages

Titles

封膠膠餅之收縮率對四邊扁平無接腳產品翹曲的研究 = The Study of Substrate Warpage in QFN Package due to Shrinkage Rate of Molding Compound by: 劉賢民; 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班 (Language materials, printed) , [撰]

Subjects