Languages
吳政鋒
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
應用田口方法改善超低放射α粒子錫膏錫珠問題之研究 = The Improvement of Solder Beads Structure of ULA Solder Paste in Flip Chip Package Using Taguchi Method
by:
吳政鋒; 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
(Language materials, printed)
, [撰]
Subjects