Languages
莊登舜
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
傳統堆疊式封裝元件注膠孔之最佳化設計與模流分析 = The Optimization Design and Numerical Simulation of Mold Flow in TRD POP Packaging
by:
國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 莊登舜
(Language materials, printed)
, [撰]