劉育銓

Overview

Works:	1 works in 1 publications in 1 languages

Titles

運用注模設計於FCBGA封裝之研究 = The Study of Molding Design for FCBGA Package by: 劉育銓; 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班 (Language materials, printed) , [撰]

Subjects