黃奕銘

Overview

Works:	1 works in 1 publications in 1 languages

Titles

封裝製程基板龜裂原因與偵出方法研究 = Investigation of Substrate Crack during IC packaging by: 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 黃奕銘 (Language materials, printed) , [撰]

Subjects