張仲堯

Overview

Works:	1 works in 1 publications in 1 languages

Titles

覆晶封裝中底膠材料參數對電性失效之影響及改善研究 = Study Underfill Material to Improve the Effect of Function Fail for Flip Chip Packaging by: 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 張仲堯 (Language materials, printed) , [撰]

Subjects