張君如

Overview

Works:	1 works in 1 publications in 1 languages

Titles

晶片尺寸模封製程孔洞缺陷之研究 = Study on Void of Molding Process for Chip Scale Packaging by: 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 張君如 (Language materials, printed) , [撰]

Subjects