林育嵩

Overview

Works:	1 works in 1 publications in 1 languages

Titles

壓模封膠餅於薄型化裝對動態記憶體應用發展之研究 = Compression Molding Compound Study of Thin Package Development for DRAM Application by: 國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班; 林育嵩 (Language materials, printed) , [撰]

Subjects