Languages
陳志僑
Overview
| Works: | 2 works in 1 publications in 1 languages | |
|---|---|---|
Titles
應用麥克森干涉法於晶圓尺寸封裝熱形變量測之研究 = The Characterization of Thermal Deformation of Wafer Level Package Using Michelson Interference Method
by:
國立高雄大學電機工程學系--電子構裝整合技術產業碩士專班; 國立高雄大學電機工程學系碩士班; 陳志僑
(Language materials, printed)
, [撰]
Subjects