許坤洋

Overview

Works:	2 works in 1 publications in 1 languages

Titles

晶圓尺寸封裝晶粒強度的量測研究 = The Study of Die Flexural Strength Test For Wafer Level Package by: 國立高雄大學電機工程學系--電子構裝整合技術產業碩士專班; 國立高雄大學電機工程學系碩士班; 許坤洋 (Language materials, printed) , [撰]

Subjects