程育昇

Overview

Works:	2 works in 1 publications in 1 languages

Titles

應用8D與六標準差改善晶圓封裝製程 = Applying 8D and the Six Sigma To Improve The Process of Wafer Packing : 以A公司為例; Company A as an Example by: 國立高雄大學亞太工商管理學系碩士在職專班; 程育昇 (Language materials, printed) , [撰]

Subjects