常吉斌

Overview

Works:	1 works in 1 publications in 1 languages

Titles

高導熱封裝製程環氧樹脂溢膠問題的探討與製程改進研究 = The Study of Epoxy Molding Compound Overflowing in High Thermal Packaging Process and its Solution by: 國立高雄大學電機工程學系--半導體製造智能化技術產業碩士專班; 常吉斌 (Language materials, printed) , [撰]

Subjects