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Gan, Chong Leong.

概要

作品:	1 作品在 2 項出版品 1 種語言

書目資訊

Interconnect reliability in advanced memory device packaging by: Gan, Chong Leong.; Huang, Chen-Yu.; SpringerLink (Online service) (書目-電子資源)

Electronic materials innovations and reliability in advanced memory packaging by: Gan, Chong Leong.; Huang, Chen-Yu.; SpringerLink (Online service) (書目-電子資源)

主題

Computer storage devices Electronics Design and Verification. Interconnects (Integrated circuit technology) Electronic packaging Materials Engineering. Electronic Circuits and Systems. Hardware Performance and Reliability. Electronic Materials. Industrial and Production Engineering.

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