Languages
詹岳霖
Overview
Works: | 1 works in 1 publications in 1 languages |
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Titles
BGA電子構裝基板設計改善鍍金區脫層之研究 = The Study of Improving Delamination of Gold-Plating Area by Substrate Design in BGA Package
by:
國立高雄大學電機工程學系--電子構裝整合技術產業碩士專班; 國立高雄大學電機工程學系碩士班; 詹岳霖
(Language materials, printed)
, [撰]