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PoP構裝製程中銀膠薄膜孔洞形成與除泡改善之研究 = Study of ...

余林旺

PoP構裝製程中銀膠薄膜孔洞形成與除泡改善之研究 = Study of the De-void in Epoxy Film in PoP Packaging

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	Study of the De-void in Epoxy Film in PoP Packaging
作者:	余林旺,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	2009[民98]
面頁冊數:	9, 64面圖，表 : 30公分;
標題:	銀膠薄膜
標題:	Epoxy film
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/23717456192200422298
摘要註:	本論文針對新型態的Fan-in PoP產品中的連結層基板與銀膠薄膜間的接合做研究，其中最常見的問題為銀膠薄膜與上下層介面之氣泡最為嚴重，這也是銀膠薄膜所面臨的最大難題。本研究特別針對在連結層基板與銀膠薄膜黏合、黏晶粒製程以及黏晶粒後烘烤製程加以研究；其中導入了一種新式烤箱，其能夠在烘烤過程中加入壓力，結果發現在黏晶粒後烘烤的過程中加入壓力，可以有效地解決銀膠薄膜在製程中所產生的氣泡孔洞問題。並且針對不同材料特性來選擇其烘烤條件以及壓力條件，以選出最適合Fan-in PoP結構之材料；在連結層基板與銀膠薄膜之接合，也利用了傳統晶圓貼合的技術，和黏晶粒的製程參數最佳化來建構出Fan-in PoP結構，並達成氣泡消除之目的，並通過JEDEC Level-3的可靠度測試。 This thesis focuses on the study of de-void; voids exist between interposer substrate and epoxy film or between epoxy film and bottom die in PoP packaging. The generation of voids causes problem in lamination of interposer substrate and epoxy film. Experiments of curing process under pressure have been performed to study the binding of interposer substrate and epoxy film, and die bonding with epoxy film. A new curing chamber under pressure is designed on purpose to eliminate voids and to evaluate the performance of package materials used in Fan-in PoP process. It is found that, thicker epoxy films and pressurized curing chamber can achieve more reliable in Fan-in PoP packaging. In addition, sets of epoxy film materials have been tried to evaluate the performance of die bonding parameters in Fan-in POP packaging process. We have demonstrated an effective way of de-void in Fan-in PoP package which can pass the reliability test by JEDEC Level-3.

PoP構裝製程中銀膠薄膜孔洞形成與除泡改善之研究 = Study of the De-void in Epoxy Film in PoP Packaging
余, 林旺

PoP構裝製程中銀膠薄膜孔洞形成與除泡改善之研究 = Study of the De-void in Epoxy Film in PoP Packaging / 余林旺撰 - [高雄市] : 撰者, 2009[民98]. - 9, 64面 ; 圖，表 ; 30公分.
參考書目：面63-64.
銀膠薄膜Epoxy film

PoP構裝製程中銀膠薄膜孔洞形成與除泡改善之研究 = Study of the De-void in Epoxy Film in PoP Packaging
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200 1 $a PoP構裝製程中銀膠薄膜孔洞形成與除泡改善之研究 $d Study of the De-void in Epoxy Film in PoP Packaging $z eng $f 余林旺撰
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328 $a 碩士論文--國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
330 $a 本論文針對新型態的Fan-in PoP產品中的連結層基板與銀膠薄膜間的接合做研究，其中最常見的問題為銀膠薄膜與上下層介面之氣泡最為嚴重，這也是銀膠薄膜所面臨的最大難題。本研究特別針對在連結層基板與銀膠薄膜黏合、黏晶粒製程以及黏晶粒後烘烤製程加以研究；其中導入了一種新式烤箱，其能夠在烘烤過程中加入壓力，結果發現在黏晶粒後烘烤的過程中加入壓力，可以有效地解決銀膠薄膜在製程中所產生的氣泡孔洞問題。並且針對不同材料特性來選擇其烘烤條件以及壓力條件，以選出最適合Fan-in PoP結構之材料；在連結層基板與銀膠薄膜之接合，也利用了傳統晶圓貼合的技術，和黏晶粒的製程參數最佳化來建構出Fan-in PoP結構，並達成氣泡消除之目的，並通過JEDEC Level-3的可靠度測試。 This thesis focuses on the study of de-void; voids exist between interposer substrate and epoxy film or between epoxy film and bottom die in PoP packaging. The generation of voids causes problem in lamination of interposer substrate and epoxy film. Experiments of curing process under pressure have been performed to study the binding of interposer substrate and epoxy film, and die bonding with epoxy film. A new curing chamber under pressure is designed on purpose to eliminate voids and to evaluate the performance of package materials used in Fan-in PoP process. It is found that, thicker epoxy films and pressurized curing chamber can achieve more reliable in Fan-in PoP packaging. In addition, sets of epoxy film materials have been tried to evaluate the performance of die bonding parameters in Fan-in POP packaging process. We have demonstrated an effective way of de-void in Fan-in PoP package which can pass the reliability test by JEDEC Level-3.
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