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引腳型塑膠封裝中外露式晶片座之脫層研究 = The Study of E...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

引腳型塑膠封裝中外露式晶片座之脫層研究 = The Study of Exposed Die Paddle on Delamination for Lead Type Plastic Package

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	The Study of Exposed Die Paddle on Delamination for Lead Type Plastic Package
作者:	陳志明,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	2009[民98]
面頁冊數:	11, 68面圖，表 : 30公分;
標題:	脫層
標題:	Delamination
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/91669747553838160809
摘要註:	引腳型塑膠封裝（Lead Type Plastic Package, LTPP）中外露式晶片座經過電解去膠製程所產生之電解效應（Electrolysis），可因氫離子（H+）與電子（e-）反應產生氫氣（H2），氫氣運動過程的碰撞力會掀離銅導線架晶片座與高分子材料的接合面造成界面脫層。文中並利用有限元素（FEM）電腦分析，對LTPP 不同分離式地線區的外露晶片座結構設計進行熱應力數值模擬。分離式地線區的外露晶片座主要目的在避免地線區域直接受應力、電解效應與脫層之影響，藉此改善目前地線區於晶片座邊緣四周的脫層。本文以高熱應力之晶片座設計配合實驗，驗證電解效應及不同去膠製程參數對界面脫層之影響，得到（1）電解去膠製程中所施予的電壓越大脫層發生的比例越高，反之電壓越低脫層發生的比例越低，但不論電解去膠電壓高或低均會有電解效應之影響導致脫層。（2）無電壓化學去膠的組別中，並未有任何脫層的狀況；此發現可應用於所有外露式晶片座之脫層改善。 In Lead Type Plastic Package, due to the electrolysis effect hydrogen ion and electrons reacted to produce hydrogen. The collision power produced during such reaction lifted open the interface between the copper lead frame die paddle and the high polymer material, and hence caused the interface delamination. This research employed Field Element Model analysis to aid the thermal stress simulation on the exposed die paddle structure design fordifferent LTPP isolated ground area. The exposed die paddle in the isolated ground area was aimed to avoid the ground area being directly influenced by stress, the electrolysis effect and delamination. This in terms improved the current delamination around the ground area and the edge of die paddle. This research incorporated the high thermal stress die paddle design in the experiments to verify the impact of the electrolysis effect and different de-flash process parameters on interface delamination. It was concluded that (1) The higher voltage used for the electrical de-flash process resulted in higher percentage of delamination. On the other hand, lower voltage caused less percentage of delamination phenomenon. However the delamination occurred regardless of the degree of applied voltages. (2) There was no delamination observed in non-electrolysis chemical de-flash process cell. Such discovery canbe applied to improve all exposed die paddle delamination.

引腳型塑膠封裝中外露式晶片座之脫層研究 = The Study of Exposed Die Paddle on Delamination for Lead Type Plastic Package
陳, 志明

引腳型塑膠封裝中外露式晶片座之脫層研究 = The Study of Exposed Die Paddle on Delamination for Lead Type Plastic Package / 陳志明撰 - [高雄市] : 撰者, 2009[民98]. - 11, 68面 ; 圖，表 ; 30公分.
參考書目：面66.
脫層Delamination

引腳型塑膠封裝中外露式晶片座之脫層研究 = The Study of Exposed Die Paddle on Delamination for Lead Type Plastic Package
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