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Wire bonding in microelectronics :ma...

Harman, George G.

Wire bonding in microelectronics :materials, processes, reliability, and yield /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Wire bonding in microelectronics :George G. Harmon.
其他題名:	materials, processes, reliability, and yield /
作者:	Harman, George G.
其他作者:	Harman, George G.
出版者:	New York :McGraw-Hill,c1997.
面頁冊數:	xiv, 290 p. :ill. ;24 cm.
附註:	Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
叢書名:	Electronic packaging and interconnection series
標題:	Wire bonding (Electronic packaging)Production control.
ISBN:	0070326193 :

Wire bonding in microelectronics :materials, processes, reliability, and yield /
Harman, George G.

Wire bonding in microelectronics :materials, processes, reliability, and yield /George G. Harmon. - 2nd ed. - New York :McGraw-Hill,c1997. - xiv, 290 p. :ill. ;24 cm. - Electronic packaging and interconnection series.

Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.

Includes bibliographical references and index.

ISBN: 0070326193 :NT$1,915

LCCN: 97019652 Subjects--Topical Terms:

182758
Wire bonding (Electronic packaging)
--Production control.

LC Class. No.: TK7836 / H287 1997

Dewey Class. No.: 621.3815

Wire bonding in microelectronics :materials, processes, reliability, and yield /
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245 1 0 $a Wire bonding in microelectronics : $b materials, processes, reliability, and yield / $c George G. Harmon.
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260 $a New York : $c c1997. $b McGraw-Hill,
300 $a xiv, 290 p. : $b ill. ; $c 24 cm.
440 0 $a Electronic packaging and interconnection series
500 $a Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
504 $a Includes bibliographical references and index.
650 $a Wire bonding (Electronic packaging) $x Production control. $3 182758
650 $a Electronic packaging $x Reliabiligy. $3 182759
650 $a Electronic packaging $x Defects. $3 182760
650 $a Semiconductors $x Failure. $3 182761
700 $a Harman, George G. $3 182757