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Engineering materials for biomedical...

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Teoh, Swee Hin.

Engineering materials for biomedical applications /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Engineering materials for biomedical applications /Teoh Swee Hin.
作者:	Teoh, Swee Hin.
出版者:	Hackensack, N.J. :World Scientific Pub.,c2004.
面頁冊數:	1 v. (various pagings) :ill. (some col.) ;24 cm.
叢書名:	Biomaterials engineering and processing series ;
標題:	Biomedical materials.
ISBN:	9812560610 (hbk.) :

Engineering materials for biomedical applications /
Teoh, Swee Hin.

Engineering materials for biomedical applications /Teoh Swee Hin. - Hackensack, N.J. :World Scientific Pub.,c2004. - 1 v. (various pagings) :ill. (some col.) ;24 cm. - Biomaterials engineering and processing series ;v. 1.

Includes bibliographical references and index.

ISBN: 9812560610 (hbk.) :NT2927

LCCN: 2006281843Subjects--Topical Terms:

193830
Biomedical materials.

LC Class. No.: R857.M3 / T427 2004

Dewey Class. No.: 610.28

Engineering materials for biomedical applications /
LDR:00703cam 22002057a 450 001 170145
003 DLC
005 20060919114353.0
008 090528s2004 njua b 001 0 eng d
010 $a 2006281843
020 $a 9812560610 (hbk.) : $c NT2927
035 $a 00234180
040 $a SISPL $c SISPL $d BAKER $d DLC $d IXA $d OCL $d OCLCQ $d TXH
042 $a lccopycat
050 0 0 $a R857.M3 $b T427 2004
082 0 0 $2 22 $a 610.28
100 $a Teoh, Swee Hin. $3 243651
245 1 0 $a Engineering materials for biomedical applications / $c Teoh Swee Hin.
260 $a Hackensack, N.J. : $c c2004. $b World Scientific Pub.,
300 $a 1 v. (various pagings) : $b ill. (some col.) ; $c 24 cm.
440 0 $a Biomaterials engineering and processing series ; $v v. 1
504 $a Includes bibliographical references and index.
650 $a Biomedical materials. $3 193830
650 $a Biomedical engineering. $3 190330

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