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Methodologies in determining mechani...

Han, Seung Min Jane.

Methodologies in determining mechanical properties of thin films using nanoindentation.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Methodologies in determining mechanical properties of thin films using nanoindentation.
作者:	Han, Seung Min Jane.
面頁冊數:	123 p.
附註:	Adviser: William D. Nix.
附註:	Source: Dissertation Abstracts International, Volume: 67-09, Section: B, page: 5339.
Contained By:	Dissertation Abstracts International67-09B.
標題:	Engineering, Materials Science.
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3235228
ISBN:	9780542894282

Methodologies in determining mechanical properties of thin films using nanoindentation.
Han, Seung Min Jane.

Methodologies in determining mechanical properties of thin films using nanoindentation. - 123 p.

Adviser: William D. Nix.

Thesis (Ph.D.)--Stanford University, 2006.

Finally, the mechanical properties of Al-Al3Sc multilayers with bilayer periods ranging from 6-100 nm were examined using microcompression. The sub-micron sized pillars were prepared using the focused ion beam (FIB) and compression tested with the flat tip of the nanoindenter. The measured yield strengths show the trend of increasing strength with decreasing bilayer period, and agree with the nanoindentation hardness results using the suitable Tabor correction factor. Strain softening was observed at large strains, and a new model for the true stress and true strain was developed to account for the inhomogeneous deformation geometry.

ISBN: 9780542894282Subjects--Topical Terms:

226940
Engineering, Materials Science.

Methodologies in determining mechanical properties of thin films using nanoindentation.
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520 # $a Finally, the mechanical properties of Al-Al3Sc multilayers with bilayer periods ranging from 6-100 nm were examined using microcompression. The sub-micron sized pillars were prepared using the focused ion beam (FIB) and compression tested with the flat tip of the nanoindenter. The measured yield strengths show the trend of increasing strength with decreasing bilayer period, and agree with the nanoindentation hardness results using the suitable Tabor correction factor. Strain softening was observed at large strains, and a new model for the true stress and true strain was developed to account for the inhomogeneous deformation geometry.
520 # $a The existing nanoindentation hardness model by Oliver & Pharr is unable to accurately determine the hardness of thin films on substrates with an elastic mismatch. Thus, a new method of analysis for extracting thin film hardness from film/substrate systems, that eliminates the effect of elastic mismatch of the underlying substrate, surface roughness, and also pile-up/sink-in, is needed. Such a method was developed in the first part of this study.
520 # $a The feasibility of using the nanoindentation hardness together with combinatorial methods to efficiently scan through mechanical properties of Ti-Al metallic alloys was examined in the second part of this study. The combinatorial approach provides an efficient method that can be used to determine alloy compositions that might merit further exploration and development as bulk materials.
520 # $a Thin films are critical components of microelectronic and MEMS devices, and evaluating their mechanical properties is of current interest. As the dimensions of the devices become smaller and smaller, however, understanding the mechanical properties of materials at sub-micron length scales becomes more challenging. The conventional methods for evaluating strengths of materials in bulk form cannot be applied, and new methodologies are required for accurately evaluating mechanical properties of thin films. In this work, development of methodologies using the nanoindenter was pursued in three parts: (1) creation of a new method for extracting thin film hardness, (2) use of combinatorial methods for determining compositions with desired mechanical properties, and (3) use of microcompression testing of sub-micron sized pillars to understand plasticity in Al-Sc multilayers.
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