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Materials for advanced packaging

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Lu, Daniel.

Materials for advanced packaging

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Materials for advanced packagingedited by Daniel Lu, C.P. Wong.
其他作者:	Wong, C.P.
出版者:	Boston, MA :Springer US,2009.
面頁冊數:	xii, 316 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	PackagingMaterials.
電子資源:	http://dx.doi.org/10.1007/978-0-387-78219-5
ISBN:	9780387782195 (electronic bk.)

Materials for advanced packaging
Materials for advanced packaging[electronic resource] /edited by Daniel Lu, C.P. Wong. - Boston, MA :Springer US,2009. - xii, 316 p. :ill., digital ;24 cm.

ISBN: 9780387782195 (electronic bk.)Subjects--Topical Terms:

338502
Packaging
--Materials.

LC Class. No.: TK7874 / .M38 2009

Dewey Class. No.: 621.381046

Materials for advanced packaging
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020 $a 9780387782188 (paper)
035 $a 978-0-387-78218-8
050 4 $a TK7874 $b .M38 2009
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245 0 0 $a Materials for advanced packaging $h [electronic resource] / $c edited by Daniel Lu, C.P. Wong.
260 $a Boston, MA : $c 2009. $b Springer US,
300 $a xii, 316 p. : $b ill., digital ; $c 24 cm.
650 0 $a Packaging $x Materials. $3 338502
650 0 $a Microelectronic packaging. $3 182088
650 1 4 $a Material Science. $3 308679
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
650 2 4 $a Metallic Materials. $3 274455
650 2 4 $a Nanotechnology. $3 193873
650 2 4 $a Optical and Electronic Materials. $3 274099
700 1 $a Wong, C.P. $3 338501
700 1 $a Lu, Daniel. $3 338500
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-0-387-78219-5
950 $a Chemistry and Materials Science (Springer-11644; ZDB-2-CMS)

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EB TK7874 M425 2009

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http://dx.doi.org/10.1007/978-0-387-78219-5

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