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Wire bonding in microelectronics

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Wire bonding in microelectronicsGeorge G. Harmon.
作者:	Harman, George G.
其他作者:	Harman, George G.
出版者:	New York :McGraw-Hill,c2010.
面頁冊數:	xx, 426 p. :ill. microelectronics. 1989.
標題:	Wire bonding (Electronic packaging)Production control.
電子資源:	Click for full text (McGrawHill)
ISBN:	9780071476232

Wire bonding in microelectronics
Harman, George G.

Wire bonding in microelectronics[electronic resource] /George G. Harmon. - 3rd ed. - New York :McGraw-Hill,c2010. - xx, 426 p. :ill. microelectronics. 1989.

ISBN: 9780071476232

LCCN: 2010287045Subjects--Topical Terms:

182758
Wire bonding (Electronic packaging)
--Production control.Index Terms--Genre/Form:

214472
Electronic books.

LC Class. No.: TK7836 / .H366 2010

Dewey Class. No.: 621.381

Wire bonding in microelectronics
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650 0 $a Electronic packaging $x Reliability. $3 190395
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