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電鍍添加劑濃度對增層法製程凸點及短路改善之研究 = The Improv...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

電鍍添加劑濃度對增層法製程凸點及短路改善之研究 = The Improvement of Plating Nodules, Whiskers, and Short Defects in Substrate Plating Process by Controlling the Concentration of Plating Addition.

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	The Improvement of Plating Nodules, Whiskers, and Short Defects in Substrate Plating Process by Controlling the Concentration of Plating Addition.
作者:	高灃,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	民100[2011]
面頁冊數:	75面圖，表 : 30公分;
標題:	銅絲
標題:	Whisker
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/96676029459873367725
摘要註:	隨著產品需求高階多功能、輕薄化、線路密集度、尺寸規格不斷提升，原有減去法流程產品其製程能力已經達到瓶頸，為符合客戶需求公司引進增層法流程予以改善。增層法流程其製程管理於製作印刷電路板已十分成熟，於IC載板尺寸遠小於傳統印刷電路板，故以增層法製作IC載板，其製程因子管理無法滿足現有產品需求。日月光電子主要供應日月光集團IC載板，本人服務於日月光電子，負責電鍍及蝕刻製程量產良率及新製程試產，其增層法流程產品於當站生產比重日益提高，然於產品量產時，其製程能力管控以及良率穩定性提升變得更加重要，長期影響此流程產品問題則首當其衝，需要獲得改善。此次研究主題便在於符合信賴性測試以及產品特性前提下，探討修正電鍍添加劑濃度，解決其增層法流程產品最主要不良率，電鍍凸點以及凸點橋接導致短路的問題。 As the trend of the development of the electronic package technology, smaller package body size, higher speed, higher pattern density, and multi function are required. For the products which produced by tenting process cannot meet the customer requirement due to the problem of the bump texture on the copper plated surface which causes the failure in wire bonding. We have developed a modification of the standard copper plating process by controlling the concentration and current flow in the electro-plating to improve the surface morphology and to pass the liability testing. We show the improvement of whiskers, and short defects in substrate electro-plating process by controlling the concentration of plating addition. As a result, the yield and process liability is improved by the tuning of the flow rate without changing the other complexity percentage of pattern plating flow.

電鍍添加劑濃度對增層法製程凸點及短路改善之研究 = The Improvement of Plating Nodules, Whiskers, and Short Defects in Substrate Plating Process by Controlling the Concentration of Plating Addition.
高, 灃

電鍍添加劑濃度對增層法製程凸點及短路改善之研究 = The Improvement of Plating Nodules, Whiskers, and Short Defects in Substrate Plating Process by Controlling the Concentration of Plating Addition. / 高灃撰 - [高雄市] : 撰者, 民100[2011]. - 75面 ; 圖，表 ; 30公分.
參考書目：面.
銅絲Whisker

電鍍添加劑濃度對增層法製程凸點及短路改善之研究 = The Improvement of Plating Nodules, Whiskers, and Short Defects in Substrate Plating Process by Controlling the Concentration of Plating Addition.
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328 $a 碩士論文--國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
330 $a 隨著產品需求高階多功能、輕薄化、線路密集度、尺寸規格不斷提升，原有減去法流程產品其製程能力已經達到瓶頸，為符合客戶需求公司引進增層法流程予以改善。增層法流程其製程管理於製作印刷電路板已十分成熟，於IC載板尺寸遠小於傳統印刷電路板，故以增層法製作IC載板，其製程因子管理無法滿足現有產品需求。日月光電子主要供應日月光集團IC載板，本人服務於日月光電子，負責電鍍及蝕刻製程量產良率及新製程試產，其增層法流程產品於當站生產比重日益提高，然於產品量產時，其製程能力管控以及良率穩定性提升變得更加重要，長期影響此流程產品問題則首當其衝，需要獲得改善。此次研究主題便在於符合信賴性測試以及產品特性前提下，探討修正電鍍添加劑濃度，解決其增層法流程產品最主要不良率，電鍍凸點以及凸點橋接導致短路的問題。 As the trend of the development of the electronic package technology, smaller package body size, higher speed, higher pattern density, and multi function are required. For the products which produced by tenting process cannot meet the customer requirement due to the problem of the bump texture on the copper plated surface which causes the failure in wire bonding. We have developed a modification of the standard copper plating process by controlling the concentration and current flow in the electro-plating to improve the surface morphology and to pass the liability testing. We show the improvement of whiskers, and short defects in substrate electro-plating process by controlling the concentration of plating addition. As a result, the yield and process liability is improved by the tuning of the flow rate without changing the other complexity percentage of pattern plating flow.
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