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The future envelope 2architecture, c...
~
Klein, Tillmann.
The future envelope 2architecture, climate, skin /
紀錄類型:
書目-電子資源 : Monograph/item
正題名/作者:
The future envelope 2edited by Ulrich Knaack & Tillmann Klein.
其他題名:
architecture, climate, skin /
其他題名:
Future envelope two
其他作者:
Knaack, Ulrich.
出版者:
Amsterdam :IOS Press,c2009.
面頁冊數:
vii, 142 p. :ill. ;24 cm.
附註:
Based on the contributions to The Future Envelope symposium held June 5, 2008 in Delft.
標題:
FacadesDesign and construction.
電子資源:
http://ebooks.windeal.com.tw/ios/cover.asp?isbn=9781607500261
ISBN:
9781607505242 (electronic bk.)
The future envelope 2architecture, climate, skin /
The future envelope 2
architecture, climate, skin /[electronic resource] :Future envelope twoedited by Ulrich Knaack & Tillmann Klein. - Amsterdam :IOS Press,c2009. - vii, 142 p. :ill. ;24 cm. - Research in architectural engineering series,v. 91873-6033 ;. - Research in architectural engineering series ;v. 9..
Based on the contributions to The Future Envelope symposium held June 5, 2008 in Delft.
Includes bibliographical references.
ISBN: 9781607505242 (electronic bk.)
LCCN: 2010290874Subjects--Topical Terms:
222981
Facades
--Design and construction.
LC Class. No.: TH2235 / .F882 2009
Dewey Class. No.: 729/.1
The future envelope 2architecture, climate, skin /
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http://ebooks.windeal.com.tw/ios/cover.asp?isbn=9781607500261
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