探討高速傳輸介面之發展趨勢 = Development Tendency...
國立高雄大學國際高階經營管理碩士在職專班(IEMBA)

 

  • 探討高速傳輸介面之發展趨勢 = Development Tendency of High Speed Transfer Interface:Technology Roadmap Analysis : 以技術地圖分析
  • Record Type: Language materials, printed : monographic
    Paralel Title: Development Tendency of High Speed Transfer Interface:Technology Roadmap Analysis
    Title Information: 以技術地圖分析
    Author: 洪家智,
    Secondary Intellectual Responsibility: 國立高雄大學
    Place of Publication: [高雄市]
    Published: 撰者;
    Year of Publication: 2012[民101]
    Description: 79面圖,表格 : 30公分;
    Subject: 高速傳輸介面
    Subject: High Speed Interfaces
    Online resource: http://handle.ncl.edu.tw/11296/ndltd/21320779827886567880
    Notes: 參考書目:面63-65
    [NT 15001349]: 以技術地圖分析
    Summary: 隨著消費者對於影音資料畫質的高要求,促使高速傳輸介面也須提高各項功能,才能符合市場需求。  本研究的目的係瞭解高速傳輸介面產品的未來發展趨勢。本研究採用問卷調查法及專家訪談法,先從消費者的需求角度,探討消費者所重視的各項功能特性,問卷調查法以自編的「高速傳輸介面發展趨勢之消費者需求」問卷為工具,並以統計方法獲得消費者最重視的產品功能特性。然後依需求調查結果為依據,以訪談專家意見對影響各功能特性發展的關鍵技術著手進行技術調查,最後再綜合此兩項調查結果所結合而成的技術矩陣,規劃出高速傳輸介面的技術地圖,以供開發廠商在投資開發時的參考。  本研究並獲致以下之研究結果:一、 本研究從消費者問卷調查的分析結果得知,消費者在Needs需求上最重視的7個功能項目包括:傳輸速度、向下相容性、傳輸時間、插拔壽命、體積縮小、傳輸穩定度及傳輸保密性。二、 本研究從專家訪談的結果可知,高速傳輸介面各項需求功能所支援的關鍵技術大致可以歸納成下列幾種:USB 3.0技術、Thunderbolt技術(銅軸線、光纖)、連接器模組製造技術、光纖線材技術、晶片封裝技術、堆疊封裝技術、以及軟體加密、身份認證技術。 綜合以上的分析結果,本研究得以繪製出高速傳輸介面的技術地圖。 To follow with the demands for the high quality of audio and video data of consumers, improving the various functions of high-speed transfer interface are also motivated in order to meet market demand.   The purpose of this study is to understand the future trends of high speed transfer interface products. This study is used by questionnaires and expert interviews. Starting from a point of view of consumer demand, discussing the various features valued by consumers. The questionnaire is used by self-made questionnaire “High-speed transfer interface, the development trend of consumer demand” as a tool, and used by the statistical methods to know the most important product features which consumers emphasized. Then, begin to conduct technical research based on the survey results and the advices by interviewing with expert on the key technologies for the development of various features. Finally, the author try to integrated these two findings into a combination of technology matrix and to plan a high-speed transfer interface technology roadmap, in order to provide reference for the manufacturers who invest in the development. The following conclusions in this study: 1) From the analysis of consumer survey results, seven consumers Needs of the most important functions include: transmission speed, backward compatibility, transmission time, plug life and reduce the size, transmission stabilityand transmission confidentiality. 2) From the results of expert interviews, this study shows that high-speed transfer interface for the needs of function supported by key technologies can be broadly grouped into the following types: USB 3.0 technology, Thunderbolt technology (copper axis, optical fiber), connector module manufacturing technology, fiber cable technology, the chip-on-board technology, stacked die package technology, and software encryption, authentication technology.In this study, a technology roadmap of high-speed transfer interface based on the above analysis results was conducted.
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310002292913 博碩士論文區(二樓) 不外借資料 學位論文 TH 008M/0019 349910 3438 2012 一般使用(Normal) On shelf 0
310002292921 博碩士論文區(二樓) 不外借資料 學位論文 TH 008M/0019 349910 3438 2012 c.2 一般使用(Normal) On shelf 0
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