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球柵陣列電子構裝中單層基板設計應用之研究 = The evaluatio...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

球柵陣列電子構裝中單層基板設計應用之研究 = The evaluation of Single Sided Substrate Design for ball grid array package

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	The evaluation of Single Sided Substrate Design for ball grid array package
作者:	蔣政谷,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	2014[民103]
面頁冊數:	67面圖，表 : 30公分;
標題:	基板設計
標題:	Substrate Design
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/56265470842883178229
附註:	參考書目：面55-56
附註:	103年12月16日公開
摘要註:	本研究將現行五種已量產的雙層板設計圖，以單層板的設計概念進行基板重新規劃，並針對兩種設計打線圖所需的金線數量進行研究。由於球柵陣列構裝產品越來越薄型化的趨勢，故封裝製程技術上，最主要的可靠度問題是翹曲變形，使用單層基板取代雙層基板，其基板總厚度可以變薄，僅有0.11mm，故本研究將針對基板尺寸17x17mm2的單層板與雙層板做熱特性模擬分析及翹曲模擬分析。由實驗結果證實利用單層板製程，可以節省打線成本，且與雙層板比較後具有良好的散熱效果及抗翹曲變形的優點，故單層板可取代基板尺寸小於17x17mm2的雙層板成為應用在球柵陣列構裝中，成本最低的BT基板。 In this study, a concept of advanced single-sided substrate design rule has been developed to improve five types of the double-sided substrate designs which are currently used in traditional IC packages. In addition, the cost of gold wire required for bonding diagram in both designs are compared and evaluated. This study also performed thermal simulation analysis and warpage which is the main technical concern in assembly due to thinning tendency of products in ball grid array package on both advanced double-sided substrate and single-sided substrate of size 17x17mm2 of 0.11mm thickness. The results showed that advanced single-sided substrate can provide more flexibility and space for design rule and also lower the cost in wire bonding process and acquire better cooling effect and anti-warpage property. In conclusion that the advanced single-sided BT substrate can be used to replace double-sided substrate of the package size smaller than 17x17mm2 Bismaleimide Triazine substrate in the application of ball grid array package.

球柵陣列電子構裝中單層基板設計應用之研究 = The evaluation of Single Sided Substrate Design for ball grid array package
蔣, 政谷

球柵陣列電子構裝中單層基板設計應用之研究 = The evaluation of Single Sided Substrate Design for ball grid array package / 蔣政谷撰 - [高雄市] : 撰者, 2014[民103]. - 67面 ; 圖，表 ; 30公分.
參考書目：面55-56103年12月16日公開.
基板設計Substrate Design

球柵陣列電子構裝中單層基板設計應用之研究 = The evaluation of Single Sided Substrate Design for ball grid array package
LDR:03085nam0a2200289 450 001 430181
005 20170214095521.0
009 430181
010 0 $b 精裝
010 0 $b 平裝
100 $a 20170214d2014 k y0chiy05 e
101 0 $a chi
102 $a tw
105 $a ak am 000yy
200 1 $a 球柵陣列電子構裝中單層基板設計應用之研究 $d The evaluation of Single Sided Substrate Design for ball grid array package $z eng $f 蔣政谷撰
210 $a [高雄市] $c 撰者 $d 2014[民103]
215 0 $a 67面 $c 圖，表 $d 30公分
300 $a 參考書目：面55-56
300 $a 103年12月16日公開
314 $a 指導教授：施明昌教授
328 $a 碩士論文--國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
330 $a 本研究將現行五種已量產的雙層板設計圖，以單層板的設計概念進行基板重新規劃，並針對兩種設計打線圖所需的金線數量進行研究。由於球柵陣列構裝產品越來越薄型化的趨勢，故封裝製程技術上，最主要的可靠度問題是翹曲變形，使用單層基板取代雙層基板，其基板總厚度可以變薄，僅有0.11mm，故本研究將針對基板尺寸17x17mm2的單層板與雙層板做熱特性模擬分析及翹曲模擬分析。由實驗結果證實利用單層板製程，可以節省打線成本，且與雙層板比較後具有良好的散熱效果及抗翹曲變形的優點，故單層板可取代基板尺寸小於17x17mm2的雙層板成為應用在球柵陣列構裝中，成本最低的BT基板。 In this study, a concept of advanced single-sided substrate design rule has been developed to improve five types of the double-sided substrate designs which are currently used in traditional IC packages. In addition, the cost of gold wire required for bonding diagram in both designs are compared and evaluated. This study also performed thermal simulation analysis and warpage which is the main technical concern in assembly due to thinning tendency of products in ball grid array package on both advanced double-sided substrate and single-sided substrate of size 17x17mm2 of 0.11mm thickness. The results showed that advanced single-sided substrate can provide more flexibility and space for design rule and also lower the cost in wire bonding process and acquire better cooling effect and anti-warpage property. In conclusion that the advanced single-sided BT substrate can be used to replace double-sided substrate of the package size smaller than 17x17mm2 Bismaleimide Triazine substrate in the application of ball grid array package.
510 1 $a The evaluation of Single Sided Substrate Design for ball grid array package $z eng
610 0 $a 基板設計 $a BT基板 $a 單層基板 $a 翹曲變形 $a 球柵陣列構裝
610 1 $a Substrate Design $a BismaleimideTriazineSubtrate $a Advanced Single Sided Substrate $a Warpage $a Ball Grid Array Package
681 $a 008M/0019 $b 542201 4418.1 $v 2007年版
700 1 $a 蔣 $b 政谷 $4 撰 $3 673399
712 0 2 $a 國立高雄大學 $b 電機工程學系--先進電子構裝技術產業研發碩士專班 $3 170852
801 0 $a tw $b NUK $c 20141021 $g CCR
856 7 $z 電子資源 $2 http $u http://handle.ncl.edu.tw/11296/ndltd/56265470842883178229