散熱片表面特性對雷射正印影響之研究 = The Influence of...
國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

 

  • 散熱片表面特性對雷射正印影響之研究 = The Influence of Characteristics of Heat Slug Surface on Laser Marking
  • 紀錄類型: 書目-語言資料,印刷品 : 單行本
    並列題名: The Influence of Characteristics of Heat Slug Surface on Laser Marking
    作者: 邱彬鴻,
    其他團體作者: 國立高雄大學
    出版地: [高雄市]
    出版者: 撰者;
    出版年: 2013[民102]
    面頁冊數: 49葉圖,表格 : 30公分;
    標題: 鍍層厚度
    標題: plating thickness
    電子資源: https://hdl.handle.net/11296/4b6z67
    附註: 108年3月25日公開
    附註: 參考書目:葉49
    摘要註: 現今的時代不是只有半導體製程技術與構裝技術在進步,就連客戶對產品外觀的品質要求也越來越嚴格,這是因為在產品印上客戶專屬的商標和字元是代表其品牌形象,從早期的油墨蓋印(Ink marking)開始,刻印板沾上油墨,麵包頭(PAD)將沾上有油墨的印字轉換蓋印至產品上,基於油墨材料的成本較高及要在較小的IC印字,是油墨蓋印無法達成的,才會有現在雷射刻印(Laser marking)的技術。以製程面來看,油墨印字的品質會比雷射刻字來得好管控,這是因為雷射刻印較容易受到材料表面特性的影響,尤其是在金屬的表面,會受到散熱片的鍍層厚度和表面粗糙度及光澤度等材料特性來影響雷射刻印的辨識度。所以,本論文會針對散熱片的鍍層厚度、表面粗糙度和光澤度三個材料特性給於不同的實驗條件,以了解散熱片材料和雷射刻印之間關係,並驗證雷射刻印的辨識度,也透過封裝製程作業性(Assembly process workability)測試和溫溼度測試(MSL : Moisture Sensitivity Levels)來確認是否會有其它的問題(Side effect)發生,最後經由實驗結果得知,欲改善雷射刻印辨識度的問題,散熱片的鍍鉻層厚度需管控在0.1μm以下,而在CCD機檢良率的部分,亮面散熱片需管控粗糙度(Ra)在0.22~0.30μm之間和光澤度(L)在48.48~50.40之間,霧面散熱片的粗糙度(Ra)需管控在0.43~0.54μm之間和光澤度(L)在65.33~71.73,依照這些材料特性來達到最佳的雷刻品質。 Recently, not only the semiconductor process and packaging technology are in progress, but also the product appearance of the customer's quality requirements are more stringent. The reason is that marked customer proprietary logo and font on the product representing its brand image. The marking technic starts from the ink marking, and it has engraved plates pad coated with ink and convert stamps to the product. However, its cost is too high and can't mark in tiny IC, and the laser marking technology is instead of it now. In the process perspective, the ink marking quality is more easily controlled than laser marking. The cause is that laser marking has more susceptible influence to material surface characteristics, especially in the metal surface. The plating thickness, surface roughness and color are three key factors affecting laser marking recognition. Therefore, this study will address H/S material properties of plating thickness, surface roughness and color, to analyze the relationship between the H/S material and laser marking. The material design is optimized through the assembly process workability and MSL test.
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310002848870 博碩士論文區(二樓) 不外借資料 學位論文 TH 008M/0019 542201 7743 2013 一般使用(Normal) 在架 0
310002848888 博碩士論文區(二樓) 不外借資料 學位論文 TH 008M/0019 542201 7743 2013 c.2 一般使用(Normal) 在架 0
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