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封膠製程中接線墊間電性變化的影響因素探討研究 = The study o...
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國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
封膠製程中接線墊間電性變化的影響因素探討研究 = The study of electric characteristics between electro pads in molding process
紀錄類型:
書目-語言資料,印刷品 : 單行本
並列題名:
The study of electric characteristics between electro pads in molding process
作者:
林永真,
其他團體作者:
國立高雄大學
出版地:
[高雄市]
出版者:
撰者;
出版年:
2014[民103]
面頁冊數:
77面圖,表 : 30公分;
標題:
封膠製程
標題:
IC package
電子資源:
http://handle.ncl.edu.tw/11296/ndltd/21620770846176285908
附註:
參考書目:面66
附註:
103年12月16日公開
摘要註:
封膠(molding)在IC封裝中是一項關鍵而重要的製程,而目前IC封裝朝薄型化發展晶粒尺寸封裝(chip size package)的產品,封膠不良所產生的故障模式如衝線、溢膠、裂縫等也相對提高,本論文主要是針對IC封裝製程中因封膠不良所造成基板信號接腳之間的漏電失效模式的原因探討,實驗中採用不同的封膠材料及注膠的製程參數,利用X-ray 、SAT(Scanning acoustic topography)、EDX(Energy Dispersive X-ray Spectrometer)進行IC封膠後接線墊間的漏電電性量測,結果發現,注膠條件控制不當容易在注膠口附近造成積碳(carbon accumulation)以及區域內接線墊間的漏電流會增加,我們也從封膠模流場(molding flux)分怖的數值模擬結果得到證實象。 Molding is a key process in IC packaging for protection and electrical inter-connection. The failure modes such as wire pushing, over dosing, mode cracking in molding process becomes more crucial and complicated for miniaturized IC packaging process as chip size package products. In this study we focus the study of the leaking characteristics between I/O pads due to various molding materials and process parameters in molding. X-ray 、SAT (Scanning acoustic topography)、EDX(Energy Dispersive X-ray Spectrometer) and electrical characterizations were used to verify the effect of leaking. As a conclusion, we showed that the leaking between the I/O electrodes around the mold injection zoon was related to the accumulated carbon element during the molding process. In addition, result from the numerical simulation of the molding flux distribution confirms that small gaps and moisture can be accumulated near the mold injection zoon when the molding parameter was not optimized. This result can provide essential reference to improve the molding process control for small form factor IC packages.
封膠製程中接線墊間電性變化的影響因素探討研究 = The study of electric characteristics between electro pads in molding process
林, 永真
封膠製程中接線墊間電性變化的影響因素探討研究
= The study of electric characteristics between electro pads in molding process / 林永真撰 - [高雄市] : 撰者, 2014[民103]. - 77面 ; 圖,表 ; 30公分.
參考書目:面66103年12月16日公開.
封膠製程IC package
封膠製程中接線墊間電性變化的影響因素探討研究 = The study of electric characteristics between electro pads in molding process
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封膠(molding)在IC封裝中是一項關鍵而重要的製程,而目前IC封裝朝薄型化發展晶粒尺寸封裝(chip size package)的產品,封膠不良所產生的故障模式如衝線、溢膠、裂縫等也相對提高,本論文主要是針對IC封裝製程中因封膠不良所造成基板信號接腳之間的漏電失效模式的原因探討,實驗中採用不同的封膠材料及注膠的製程參數,利用X-ray 、SAT(Scanning acoustic topography)、EDX(Energy Dispersive X-ray Spectrometer)進行IC封膠後接線墊間的漏電電性量測,結果發現,注膠條件控制不當容易在注膠口附近造成積碳(carbon accumulation)以及區域內接線墊間的漏電流會增加,我們也從封膠模流場(molding flux)分怖的數值模擬結果得到證實象。 Molding is a key process in IC packaging for protection and electrical inter-connection. The failure modes such as wire pushing, over dosing, mode cracking in molding process becomes more crucial and complicated for miniaturized IC packaging process as chip size package products. In this study we focus the study of the leaking characteristics between I/O pads due to various molding materials and process parameters in molding. X-ray 、SAT (Scanning acoustic topography)、EDX(Energy Dispersive X-ray Spectrometer) and electrical characterizations were used to verify the effect of leaking. As a conclusion, we showed that the leaking between the I/O electrodes around the mold injection zoon was related to the accumulated carbon element during the molding process. In addition, result from the numerical simulation of the molding flux distribution confirms that small gaps and moisture can be accumulated near the mold injection zoon when the molding parameter was not optimized. This result can provide essential reference to improve the molding process control for small form factor IC packages.
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http://handle.ncl.edu.tw/11296/ndltd/21620770846176285908
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