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指紋感測器於球狀閘極陣列封裝之特性改善 = Study and impr...
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國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
指紋感測器於球狀閘極陣列封裝之特性改善 = Study and improve the characteristic of fingerprinter sensor on ball grid array package
紀錄類型:
書目-語言資料,印刷品 : 單行本
並列題名:
Study and improve the characteristic of fingerprinter sensor on ball grid array package
作者:
謝采芸,
其他團體作者:
國立高雄大學
出版地:
[高雄市]
出版者:
撰者;
出版年:
2015[民104]
面頁冊數:
46面圖,表 : 30公分;
標題:
介電常數
標題:
Dielectric Constant
電子資源:
http://handle.ncl.edu.tw/11296/ndltd/81520468333092218456
附註:
104年10月31日公開
附註:
參考書目:面36
摘要註:
探討本論文的原因是因為個人行動裝置設備正在迅速發展,因此指紋辨識系統已經引起了人們的注意。類似於觸碰面板裝置的原理,但指紋辨識需要更高的靈敏度和更精確的設計來感測指紋的微小變化。首先主要是敘述指紋感測器的基本背景,第二部分簡單介紹了電容式指紋感測器的原理,包括光學和電容式感測器,此外對於成本、尺寸和性能的比較也進行了討論。接著田口方法分析被導入並應用在模擬結果以優化指紋感測器的設計。第四部分展示了封裝結構及封裝設計的各個因素對電容式指紋感測器的性能的影響,最後將模擬的結果進行了總結。當然,研究此設計的用意是希望最好的設計規則能夠被發現,以便分析更多的因素和提高指紋感測器封裝設計的靈敏度。 Fingerprint identification system has caught people's eyes because personal mobile device is getting development rapidly recent years. Similar to the principle of touch screen panel device, but a fingerprint identification IC needs the design with higher sensitivity and more accurate design to sense the tiny variations on a fingerprint. So that it could be qualified and adopted at verifications of identifications, even for mobile payment in the future. The first is an introduction of study background. The second section of this paper simply introduces the principle of capacitive fingerprint sensors including optical and capacitive sensors. In addition, the comparisons of cost, size, and performance also have been discussed. Then, the Taguchi analysis method is introduced and will be applied on the simulation results to optimize the design of fingereprint sensor. The fourth part shows the package structure and each factor of package design which effects capacitive fingerprint sensor performance. Then, the simulation results are summarized and concluded all design factors to the performance. Of course, the best design rule is able to be found out. Later, Taguchi analysis is participated in order to analyze more factors and advanced improve the sensitivity of package design. Final is the conclusion.
指紋感測器於球狀閘極陣列封裝之特性改善 = Study and improve the characteristic of fingerprinter sensor on ball grid array package
謝, 采芸
指紋感測器於球狀閘極陣列封裝之特性改善
= Study and improve the characteristic of fingerprinter sensor on ball grid array package / 謝采芸撰 - [高雄市] : 撰者, 2015[民104]. - 46面 ; 圖,表 ; 30公分.
104年10月31日公開參考書目:面36.
介電常數Dielectric Constant
指紋感測器於球狀閘極陣列封裝之特性改善 = Study and improve the characteristic of fingerprinter sensor on ball grid array package
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探討本論文的原因是因為個人行動裝置設備正在迅速發展,因此指紋辨識系統已經引起了人們的注意。類似於觸碰面板裝置的原理,但指紋辨識需要更高的靈敏度和更精確的設計來感測指紋的微小變化。首先主要是敘述指紋感測器的基本背景,第二部分簡單介紹了電容式指紋感測器的原理,包括光學和電容式感測器,此外對於成本、尺寸和性能的比較也進行了討論。接著田口方法分析被導入並應用在模擬結果以優化指紋感測器的設計。第四部分展示了封裝結構及封裝設計的各個因素對電容式指紋感測器的性能的影響,最後將模擬的結果進行了總結。當然,研究此設計的用意是希望最好的設計規則能夠被發現,以便分析更多的因素和提高指紋感測器封裝設計的靈敏度。 Fingerprint identification system has caught people's eyes because personal mobile device is getting development rapidly recent years. Similar to the principle of touch screen panel device, but a fingerprint identification IC needs the design with higher sensitivity and more accurate design to sense the tiny variations on a fingerprint. So that it could be qualified and adopted at verifications of identifications, even for mobile payment in the future. The first is an introduction of study background. The second section of this paper simply introduces the principle of capacitive fingerprint sensors including optical and capacitive sensors. In addition, the comparisons of cost, size, and performance also have been discussed. Then, the Taguchi analysis method is introduced and will be applied on the simulation results to optimize the design of fingereprint sensor. The fourth part shows the package structure and each factor of package design which effects capacitive fingerprint sensor performance. Then, the simulation results are summarized and concluded all design factors to the performance. Of course, the best design rule is able to be found out. Later, Taguchi analysis is participated in order to analyze more factors and advanced improve the sensitivity of package design. Final is the conclusion.
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