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FCBGA封膠製程中注模孔洞缺陷的研究 = The Study of V...

俞常利

FCBGA封膠製程中注模孔洞缺陷的研究 = The Study of Void Defects in FCBGA Molding Process

Record Type:	Language materials, printed : monographic
Paralel Title:	The Study of Void Defects in FCBGA Molding Process
Author:	俞常利,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	國立高雄大學;
Year of Publication:	2015[民104]
Description:	[8]，66葉圖，表 : 30公分;
Subject:	封膠材料
Subject:	Epoxy molding compound
Online resource:	https://hdl.handle.net/11296/54f8s3
Notes:	109年11月18日公開
Summary:	在封裝製程當中,封膠材料環氧樹脂 (Epoxy Molding Compound,EMC),在密閉空間 (Mold Cap.) 中,高溫與高壓的壓注之下,會在過程中因為真空不良、材料變異與模具差異⋯等因素影響之下,產生孔洞缺陷的問題。由於孔洞缺陷會對封膠後的產品在後製程的高溫中產生影響,所以孔洞缺陷是不可被允許的缺陷。封膠後的產品如有孔洞缺陷,在後製程的高溫下,有極高的機率會發生錫球擠壓 (Solder Extrusion) 的缺點模式,造成橋接 (Bridge) 的現象,導致短路 (Short) 異常。本論文係針對半導體封裝製程中,封膠製程 (Molding) 中發生孔洞缺陷 (Void defects) 之生成原因進行研究與改善,以參數的控制下,分析出溫度、壓力、時間與模具配合下,探討孔洞缺陷生成的研究。本研究針對孔洞缺陷,以不變動封膠材料的前提之下,針對模具設計及參數控制 (包含真空、壓力、時間及溫度) 的實驗下,利用超音波掃描震盪器 (Scanning Acoustics Test,SAT) 及截面分析 (Cross Section) 來分析是否有孔洞缺陷的問題,並作相互之間的關係比較,探討孔洞缺陷如何減少的比較與研究。 Voids are usually occurred in molding process which is a close space of high temperature and pressure condition, and will produce liability issues such as solder extrusion and bridge to short. Usually, void defects is affected by parameters of mold chase vacuum condition, interfacing mechanism between substrate and molding compound, and process control factors. This thesis is focused on the study of the effects of mold temperature, pressure, process time and mold chase condition for a optimized mold process control. Scanning acoustic tomography (SAT) and scanning electron microscope (SEM) are used to scan the cross section at the location of voids and analyzed to explore the correlation of the voids generation due to the parameters of molding process control.

FCBGA封膠製程中注模孔洞缺陷的研究 = The Study of Void Defects in FCBGA Molding Process
俞, 常利

FCBGA封膠製程中注模孔洞缺陷的研究 = The Study of Void Defects in FCBGA Molding Process / 俞常利撰 - [高雄市] : 國立高雄大學, 2015[民104]. - [8]，66葉 ; 圖，表 ; 30公分.
109年11月18日公開.
參考書目：葉54.
封膠材料Epoxy molding compound

FCBGA封膠製程中注模孔洞缺陷的研究 = The Study of Void Defects in FCBGA Molding Process
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