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IC封裝中環氧樹脂對封模線偏移的影響 = Study of Epoxy ...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

IC封裝中環氧樹脂對封模線偏移的影響 = Study of Epoxy on Molding Wire Sweep in IC Package

Record Type:	Language materials, printed : monographic
Paralel Title:	Study of Epoxy on Molding Wire Sweep in IC Package
Author:	李明勳,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2015[民104]
Description:	67面圖，表 : 30公分;
Subject:	引腳數
Subject:	Lead frame
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/68480136855486710264
Notes:	104年10月31日公開
Notes:	參考書目：面55
Summary:	現在IC產品功能多樣化,打線方式複雜,引腳數越來越多,在封裝過程中,封模製程的掌握是很重要的一環。本文針對產品封模後線偏移的影響,藉由三種封模材料的特性和製程參數模具溫度的調整,研究發現模具溫度及黏滯係數的差異會影響線偏移的發生率,並使用超音波檢驗孔洞、X-ray檢驗線偏移量及開路短路測試是否有線斷或線短路,最後進行可靠度的測試。 Recently the development of IC becomes tremendous and the function becomes diversify. The number of lead frame increases a lot and the wire design becomes complex to meet the function of IC. The molding control becomes an issue in the IC package process.This thesis studied the wire sweep behavior in molding process. Three different mold materials were applied first to study the wire sweep behavior. Then, study of two materials with different mold temperature were accessed to realized the effect of temperature. The SAT, X-ray image and open-short test were applied for characterization. Results show that the material viscosity and mold temperature both dominate the yield of wire sweep. With controlled mold material and process parameter, high IC package yield can be achieved.

IC封裝中環氧樹脂對封模線偏移的影響 = Study of Epoxy on Molding Wire Sweep in IC Package
李, 明勳

IC封裝中環氧樹脂對封模線偏移的影響 = Study of Epoxy on Molding Wire Sweep in IC Package / 李明勳撰 - [高雄市] : 撰者, 2015[民104]. - 67面 ; 圖，表 ; 30公分.
104年10月31日公開參考書目：面55.
引腳數Lead frame

IC封裝中環氧樹脂對封模線偏移的影響 = Study of Epoxy on Molding Wire Sweep in IC Package
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328 $a 碩士論文--國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
330 $a 現在IC產品功能多樣化,打線方式複雜,引腳數越來越多,在封裝過程中,封模製程的掌握是很重要的一環。本文針對產品封模後線偏移的影響,藉由三種封模材料的特性和製程參數模具溫度的調整,研究發現模具溫度及黏滯係數的差異會影響線偏移的發生率,並使用超音波檢驗孔洞、X-ray檢驗線偏移量及開路短路測試是否有線斷或線短路,最後進行可靠度的測試。 Recently the development of IC becomes tremendous and the function becomes diversify. The number of lead frame increases a lot and the wire design becomes complex to meet the function of IC. The molding control becomes an issue in the IC package process.This thesis studied the wire sweep behavior in molding process. Three different mold materials were applied first to study the wire sweep behavior. Then, study of two materials with different mold temperature were accessed to realized the effect of temperature. The SAT, X-ray image and open-short test were applied for characterization. Results show that the material viscosity and mold temperature both dominate the yield of wire sweep. With controlled mold material and process parameter, high IC package yield can be achieved.
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