國立高雄大學圖資館 |

Language: English

Back

球柵陣列電子構裝中基板與膠體脫層影響之可靠度分析與改善 = The An...

國立高雄大學電機工程學系碩士班

球柵陣列電子構裝中基板與膠體脫層影響之可靠度分析與改善 = The Analysis And Improvement On The Reliability For Delamination Issue Between Substrate And Molding Compound Of BGA Package

Record Type:	Language materials, printed : monographic
Paralel Title:	The Analysis And Improvement On The Reliability For Delamination Issue Between Substrate And Molding Compound Of BGA Package
Author:	蔡心怡,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2015[民104]
Description:	75面圖，表 : 30公分;
Subject:	半導體
Subject:	assembly
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/95843127887987472085
Notes:	參考書目：面61-62
Summary:	封裝製程上面臨諸多挑戰,諸如導線架的設計日趨複雜、封裝材料的選用、封裝製程中金線數目的高密度集積化、及模流充填時所產生的金線偏移與薄型封裝翹曲變形、及膠餅材料的特性等問題,都是目前產業界所遭遇極欲解決的難題。此研究主題,探討改變製程參數及膠餅材料特性,並採用田口實驗方法及各項檢查工具,及環測作為驗證,並找到最佳的組合參數達到解決產品的脫層缺點模式。為了解決基板與膠餅delamination的問題，1.使用了不同的基版,因為粗糙度越高膠餅與基版的結合力越好。2.使用的不同成份的膠餅,讓膠餅跟基版的結合力更佳。3.在製程中更改了模流的壓力,讓膠餅內不易產生空氣。4.製程中更改了合模的壓力,讓膠餅的模具內不易產生空氣泡。5.提高的plasma的清洗功率,讓基版能清洗乾淨避免有雜質。以上的因子變更能改善基版及膠餅的delamination的問題。 It has a lot of challenge on assembly. For example, the design of leadfream, the material of assembly, the compressed wire in the package, the wire shift when compound full in the package, the warpage of thin assembly package and the feature of molding compound. Those are the problems needs to solve. The topic of thesis to study on change the process and change the material of compound. Using the DOE experiment and all kinds of experiment instruments and evaluation on reliability. Those studies for solve the delaminition issue. For solve the delaminition between substrate and compound. 1. Using the different roughness of substrate. Due to higher roughness compound and substrate can joint well. 2. Using different element of compound to increase the joint capability. 3. Change the compound flow in the process. It will not easy to produce bubble in the package. 4. Change the clamp pressure. It will not easy to produce the bubble in the tool. 5. Increase the clean power of plasma for reduce the foreign materialAbove items can improvement the delamination between substrate and compound.

球柵陣列電子構裝中基板與膠體脫層影響之可靠度分析與改善 = The Analysis And Improvement On The Reliability For Delamination Issue Between Substrate And Molding Compound Of BGA Package
蔡, 心怡

球柵陣列電子構裝中基板與膠體脫層影響之可靠度分析與改善 = The Analysis And Improvement On The Reliability For Delamination Issue Between Substrate And Molding Compound Of BGA Package / 蔡心怡撰 - [高雄市] : 撰者, 2015[民104]. - 75面 ; 圖，表 ; 30公分.
參考書目：面61-62.
半導體assembly

球柵陣列電子構裝中基板與膠體脫層影響之可靠度分析與改善 = The Analysis And Improvement On The Reliability For Delamination Issue Between Substrate And Molding Compound Of BGA Package
LDR:03353nam0a2200277 450 001 458454
005 20170214095520.0
009 458454
010 0 $b 精裝
010 0 $b 平裝
100 $a 20170214d2015 k y0chiy50 e
101 0 $a chi
102 $a tw
105 $a ak am 000yy
200 1 $a 球柵陣列電子構裝中基板與膠體脫層影響之可靠度分析與改善 $d The Analysis And Improvement On The Reliability For Delamination Issue Between Substrate And Molding Compound Of BGA Package $z eng $f 蔡心怡撰
210 $a [高雄市] $c 撰者 $d 2015[民104]
215 0 $a 75面 $c 圖，表 $d 30公分
300 $a 參考書目：面61-62
314 $a 指導教授：葉文冠博士
328 $a 碩士論文--國立高雄大學電機工程學系碩士班
330 $a 封裝製程上面臨諸多挑戰,諸如導線架的設計日趨複雜、封裝材料的選用、封裝製程中金線數目的高密度集積化、及模流充填時所產生的金線偏移與薄型封裝翹曲變形、及膠餅材料的特性等問題,都是目前產業界所遭遇極欲解決的難題。此研究主題,探討改變製程參數及膠餅材料特性,並採用田口實驗方法及各項檢查工具,及環測作為驗證,並找到最佳的組合參數達到解決產品的脫層缺點模式。為了解決基板與膠餅delamination的問題，1.使用了不同的基版,因為粗糙度越高膠餅與基版的結合力越好。2.使用的不同成份的膠餅,讓膠餅跟基版的結合力更佳。3.在製程中更改了模流的壓力,讓膠餅內不易產生空氣。4.製程中更改了合模的壓力,讓膠餅的模具內不易產生空氣泡。5.提高的plasma的清洗功率,讓基版能清洗乾淨避免有雜質。以上的因子變更能改善基版及膠餅的delamination的問題。 It has a lot of challenge on assembly. For example, the design of leadfream, the material of assembly, the compressed wire in the package, the wire shift when compound full in the package, the warpage of thin assembly package and the feature of molding compound. Those are the problems needs to solve. The topic of thesis to study on change the process and change the material of compound. Using the DOE experiment and all kinds of experiment instruments and evaluation on reliability. Those studies for solve the delaminition issue. For solve the delaminition between substrate and compound. 1. Using the different roughness of substrate. Due to higher roughness compound and substrate can joint well. 2. Using different element of compound to increase the joint capability. 3. Change the compound flow in the process. It will not easy to produce bubble in the package. 4. Change the clamp pressure. It will not easy to produce the bubble in the tool. 5. Increase the clean power of plasma for reduce the foreign materialAbove items can improvement the delamination between substrate and compound.
510 1 $a The Analysis And Improvement On The Reliability For Delamination Issue Between Substrate And Molding Compound Of BGA Package $z eng
610 0 $a 半導體 $a 可靠度 $a 脫層 $a 田口實驗 $a 膠餅 $a 基板
610 1 $a assembly $a reliability $a delamination $a DOE $a compound $a substrate
681 $a 008M/0019 $b 542201 4439.1 $v 2007年版
700 1 $a 蔡 $b 心怡 $4 撰 $3 709694
712 0 2 $a 國立高雄大學 $b 電機工程學系碩士班 $3 166118
801 0 $a tw $b NUK $c 20151021 $g CCR
856 7 $z 電子資源 $2 http $u http://handle.ncl.edu.tw/11296/ndltd/95843127887987472085