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Carbon nanotube based VLSI interconn...

Kaushik, Brajesh Kumar.

Carbon nanotube based VLSI interconnectsanalysis and design /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Carbon nanotube based VLSI interconnectsby Brajesh Kumar Kaushik, Manoj Kumar Majumder.
其他題名:	analysis and design /
作者:	Kaushik, Brajesh Kumar.
其他作者:	Majumder, Manoj Kumar.
出版者:	New Delhi :Springer India :2015.
面頁冊數:	xi, 86 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	Interconnects (Integrated circuit technology)
電子資源:	http://dx.doi.org/10.1007/978-81-322-2047-3
ISBN:	9788132220473 (electronic bk.)

Carbon nanotube based VLSI interconnectsanalysis and design /
Kaushik, Brajesh Kumar.

Carbon nanotube based VLSI interconnectsanalysis and design /[electronic resource] :by Brajesh Kumar Kaushik, Manoj Kumar Majumder. - New Delhi :Springer India :2015. - xi, 86 p. :ill., digital ;24 cm. - SpringerBriefs in applied sciences and technology,2191-530X. - SpringerBriefs in applied sciences and technology..

Interconnects -- Carbon Nanotube -- Properties and Applications -- Modeling of Carbon Nanotube Interconnects -- Crosstalk and Delay Analysis -- Mixed Carbon Nanotube Bundle -- References.

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

ISBN: 9788132220473 (electronic bk.)

Standard No.: 10.1007/978-81-322-2047-3doiSubjects--Topical Terms:

224341
Interconnects (Integrated circuit technology)

LC Class. No.: TK7874.53

Dewey Class. No.: 621.395

Carbon nanotube based VLSI interconnectsanalysis and design /
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