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Photonic packaging sourcebookfiber-c...

Fischer-Hirchert, Ulrich H. P.

Photonic packaging sourcebookfiber-chip coupling for optical components, basic calculations, modules /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Photonic packaging sourcebookby Ulrich H. P. Fischer-Hirchert.
其他題名:	fiber-chip coupling for optical components, basic calculations, modules /
作者:	Fischer-Hirchert, Ulrich H. P.
出版者:	Berlin, Heidelberg :Springer Berlin Heidelberg :2015.
面頁冊數:	xix, 325 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	Nanotechnology and Microengineering.
電子資源:	http://dx.doi.org/10.1007/978-3-642-25376-8
ISBN:	9783642253768 (electronic bk.)

Photonic packaging sourcebookfiber-chip coupling for optical components, basic calculations, modules /
Fischer-Hirchert, Ulrich H. P.

Photonic packaging sourcebookfiber-chip coupling for optical components, basic calculations, modules /[electronic resource] :by Ulrich H. P. Fischer-Hirchert. - Berlin, Heidelberg :Springer Berlin Heidelberg :2015. - xix, 325 p. :ill., digital ;24 cm.

Introduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index.

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

ISBN: 9783642253768 (electronic bk.)

Standard No.: 10.1007/978-3-642-25376-8doiSubjects--Topical Terms:

348421
Nanotechnology and Microengineering.

LC Class. No.: TA1520

Dewey Class. No.: 621.365

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505 0 $a Introduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index.
520 $a This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
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