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VLSI-SoCdesign for reliability, secu...

(1998 :)

VLSI-SoCdesign for reliability, security, and low power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015 : revised selected papers /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	VLSI-SoCedited by Youngsoo Shin ... [et al.].
其他題名:	design for reliability, security, and low power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015 : revised selected papers /
其他題名:	VLSI-SoC 2015
其他作者:	Shin, Youngsoo.
團體作者:
出版者:	Cham :Springer International Publishing :2016.
面頁冊數:	xiii, 223 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	Internet of thingsCongresses.
電子資源:	http://dx.doi.org/10.1007/978-3-319-46097-0
ISBN:	9783319460970$q(electronic bk.)

VLSI-SoCdesign for reliability, security, and low power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015 : revised selected papers /
VLSI-SoCdesign for reliability, security, and low power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015 : revised selected papers /[electronic resource] :VLSI-SoC 2015edited by Youngsoo Shin ... [et al.]. - Cham :Springer International Publishing :2016. - xiii, 223 p. :ill., digital ;24 cm. - IFIP advances in information and communication technology,4831868-4238 ;. - IFIP advances in information and communication technology ;370..

This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.

ISBN: 9783319460970$q(electronic bk.)

Standard No.: 10.1007/978-3-319-46097-0doiSubjects--Topical Terms:

696440
Internet of things
--Congresses.

LC Class. No.: QA76.9.C643

Dewey Class. No.: 004.6

VLSI-SoCdesign for reliability, security, and low power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015 : revised selected papers /
LDR:01866nmm a2200325 a 4500 001 497301
003 DE-He213
005 20160912114346.0
006 m d
007 cr nn 008maaau
008 170420s2016 gw s 0 eng d
020 $a 9783319460970$q(electronic bk.)
020 $a 9783319460963$q(paper)
024 7 $a 10.1007/978-3-319-46097-0 $2 doi
035 $a 978-3-319-46097-0
040 $a GP $c GP
041 0 $a eng
050 4 $a QA76.9.C643
072 7 $a UT $2 bicssc
072 7 $a COM067000 $2 bisacsh
082 0 4 $a 004.6 $2 23
090 $a QA76.9.C643 $b I23 2015
111 2 $n (3rd : $d 1998 : $c Amsterdam, Netherlands) $3 194767
245 1 0 $a VLSI-SoC $h [electronic resource] : $b design for reliability, security, and low power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015 : revised selected papers / $c edited by Youngsoo Shin ... [et al.].
246 3 $a VLSI-SoC 2015
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2016.
300 $a xiii, 223 p. : $b ill., digital ; $c 24 cm.
490 1 $a IFIP advances in information and communication technology, $x 1868-4238 ; $v 483
520 $a This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.
650 0 $a Internet of things $v Congresses. $3 696440
650 0 $a Integrated circuits $x Very large scale integration $v Congresses. $3 484911
650 1 4 $a Computer Science. $3 212513
650 2 4 $a Computer Systems Organization and Communication Networks. $3 273709
650 2 4 $a Computer Hardware. $3 275482
650 2 4 $a Computer-Aided Engineering (CAD, CAE) and Design. $3 274500
650 2 4 $a Circuits and Systems. $3 274416
700 1 $a Shin, Youngsoo. $3 759913
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer eBooks
830 0 $a IFIP advances in information and communication technology ; $v 370. $3 559662
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-46097-0
950 $a Computer Science (Springer-11645)