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3D microelectronic packagingfrom fun...

Goyal, Deepak.

3D microelectronic packagingfrom fundamentals to applications /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	3D microelectronic packagingedited by Yan Li, Deepak Goyal.
其他題名:	from fundamentals to applications /
其他作者:	Li, Yan.
出版者:	Cham :Springer International Publishing :2017.
面頁冊數:	ix, 463 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	MicroelectronicsPackaging.
電子資源:	http://dx.doi.org/10.1007/978-3-319-44586-1
ISBN:	9783319445861$q(electronic bk.)

3D microelectronic packagingfrom fundamentals to applications /
3D microelectronic packagingfrom fundamentals to applications /[electronic resource] :edited by Yan Li, Deepak Goyal. - Cham :Springer International Publishing :2017. - ix, 463 p. :ill., digital ;24 cm. - Springer series in advanced microelectronics,v.571437-0387 ;. - Springer series in advanced microelectronics ;3..

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology.

ISBN: 9783319445861$q(electronic bk.)

Standard No.: 10.1007/978-3-319-44586-1doiSubjects--Topical Terms:

773050
Microelectronics
--Packaging.

LC Class. No.: TK7874

Dewey Class. No.: 621.381

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