Advanced packaging and manufacturing...
Seok, Seonho.

 

  • Advanced packaging and manufacturing technology based on adhesion engineeringwafer-level transfer packaging and fabrication techniques using interface energy control method /
  • 紀錄類型: 書目-電子資源 : Monograph/item
    正題名/作者: Advanced packaging and manufacturing technology based on adhesion engineeringby Seonho Seok.
    其他題名: wafer-level transfer packaging and fabrication techniques using interface energy control method /
    作者: Seok, Seonho.
    出版者: Cham :Springer International Publishing :2018.
    面頁冊數: viii, 115 p. :ill., digital ;24 cm.
    Contained By: Springer eBooks
    標題: Engineering.
    電子資源: http://dx.doi.org/10.1007/978-3-319-77872-3
    ISBN: 9783319778723$q(electronic bk.)
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