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Systems-level packaging for Millimet...

Bozanic, Mladen.

Systems-level packaging for Millimeter-Wave transceivers

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Systems-level packaging for Millimeter-Wave transceiversby Mladen Bozanic, Saurabh Sinha.
作者:	Bozanic, Mladen.
其他作者:	Sinha, Saurabh.
出版者:	Cham :Springer International Publishing :2019.
面頁冊數:	xv, 277 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	Millimeter wave communication systems.
電子資源:	https://doi.org/10.1007/978-3-030-14690-0
ISBN:	9783030146900$q(electronic bk.)

Systems-level packaging for Millimeter-Wave transceivers
Bozanic, Mladen.

Systems-level packaging for Millimeter-Wave transceivers[electronic resource] /by Mladen Bozanic, Saurabh Sinha. - Cham :Springer International Publishing :2019. - xv, 277 p. :ill., digital ;24 cm. - Smart sensors, measurement and instrumentation,v.342194-8402 ;. - Smart sensors, measurement and instrumentation ;v.8..

Introduction and Research Impact -- Millimeter-Wave Research Challenges -- Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.

ISBN: 9783030146900$q(electronic bk.)

Standard No.: 10.1007/978-3-030-14690-0doiSubjects--Topical Terms:

275476
Millimeter wave communication systems.

LC Class. No.: TK5103.4835

Dewey Class. No.: 621.384

Systems-level packaging for Millimeter-Wave transceivers
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520 $a This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
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