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Power, thermal, noise, and signal in...

Gontrand, Christian,

Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /Yue Ma and Christian Gontrand.
作者:	Ma, Yue
其他作者:	Gontrand, Christian,
面頁冊數:	xiii,226 p. : illustrations ; 24 cm
標題:	Three-dimensional integrated circuits.
ISBN:	9780367023430

Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /
Ma, Yue(Electronics engineer),

Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /Yue Ma and Christian Gontrand. - xiii,226 p. : illustrations ; 24 cm

ISBN: 9780367023430GBP$104.00

LCCN: 2018045497Subjects--Topical Terms:

717043
Three-dimensional integrated circuits.

LC Class. No.: TK7874.893 / .M33 2018

Dewey Class. No.: 621.3815/31

Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /
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