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Silicon analog componentsdevice desi...

El-Kareh, Badih.

Silicon analog componentsdevice design, process integration, characterization, and reliability /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Silicon analog componentsby Badih El-Kareh, Lou N. Hutter.
其他題名:	device design, process integration, characterization, and reliability /
作者:	El-Kareh, Badih.
其他作者:	Hutter, Lou N.
出版者:	Cham :Springer International Publishing :2020.
面頁冊數:	xlix, 648 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer eBooks
標題:	Analog integrated circuitsMaterials.
電子資源:	https://doi.org/10.1007/978-3-030-15085-3
ISBN:	9783030150853$q(electronic bk.)

Silicon analog componentsdevice design, process integration, characterization, and reliability /
El-Kareh, Badih.

Silicon analog componentsdevice design, process integration, characterization, and reliability /[electronic resource] :by Badih El-Kareh, Lou N. Hutter. - Second edition. - Cham :Springer International Publishing :2020. - xlix, 648 p. :ill. (some col.), digital ;24 cm.

The World Is Analog -- Review of Single-Crystal Silicon Properties -- PN Junctions -- Rectifying and Ohmic Contacts -- Bipolar and Junction Field-Effect Transistors -- Analog/RF CMOS -- High-Voltage and Power Transistors -- Passive Components -- Process Integration -- Mismatch and Noise -- Chip Reliability.

This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors' extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications; Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing.

ISBN: 9783030150853$q(electronic bk.)

Standard No.: 10.1007/978-3-030-15085-3doiSubjects--Topical Terms:

726587
Analog integrated circuits
--Materials.

LC Class. No.: TK7874 / .E4 2020

Dewey Class. No.: 621.3815

Silicon analog componentsdevice design, process integration, characterization, and reliability /
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520 $a This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors' extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications; Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing.
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