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Fundamentals of device and systems p...

Tummala, Rao R., (1942-)

Fundamentals of device and systems packaging :technologies and applications /

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Fundamentals of device and systems packaging :Rao R. Tummala, editor.
其他題名:	technologies and applications /
其他作者:	Tummala, Rao R.,
出版者:	New York :McGraw-Hill,c2019.
面頁冊數:	xx, 828 p. :ill. ;25 cm.
標題:	Microelectronic packaging.
ISBN:	9781259861550 :

Fundamentals of device and systems packaging :technologies and applications /
Fundamentals of device and systems packaging :technologies and applications /Rao R. Tummala, editor. - 2nd ed. - New York :McGraw-Hill,c2019. - xx, 828 p. :ill. ;25 cm.

Includes bibliographical references and index.

1 Introduction to Device and Systems Packaging Technologies --

ISBN: 9781259861550 :NT$4829

LCCN: 2019944553

Nat. Bib. No.: GBB9C4599bnb

Nat. Bib. Agency Control No.: 019469712UkSubjects--Topical Terms:

182088
Microelectronic packaging.

LC Class. No.: TK7870.15 / .F86 2019

Dewey Class. No.: 621.381/046

Fundamentals of device and systems packaging :technologies and applications /
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245 0 0 $a Fundamentals of device and systems packaging : $b technologies and applications / $c Rao R. Tummala, editor.
250 $a 2nd ed.
260 $a New York : $b McGraw-Hill, $c c2019.
300 $a xx, 828 p. : $b ill. ; $c 25 cm.
504 $a Includes bibliographical references and index.
505 0 0 $t 1 Introduction to Device and Systems Packaging Technologies -- $t 1.1 What Is Packaging and Why? -- $t 1.2 Anatomy of an Electronic Packaged Systemfrom a Packaging Point of View -- $t 1.3 Devices and Moore?s Law -- $t 1.4 Electronic Technology Waves: Microelectronics, RF/Wireless, Photonics, MEMS,and Quantum Devices -- $t 1.5 Packaging and Moore?s Law for Packaging -- $t 1.6Electronic Systems Technologies Trends -- $t 1.7 Future Outlook -- $t 1.8 Howthe Book Is Organized -- $t 1.9 Homework Problems -- $t 1.10 Suggested Reading-- $t Part 1 Fundamentals of Packaging -- $t 2 Fundamentals of Electrical Designfor Signals, Power, and Electromagnetic Interference -- $t 3 Fundamentals ofThermal Technologies -- $t 4 Fundamentals of Thermo-Mechanical Reliability -- $t 5 Fundamentals of Package Materials at Microscale and Nanoscale -- $t 6Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates -- $t 7 Fundamentals of Passive Components and Integration with Active Devices-- $t 8 Fundamentals of Chip-to-Package Interconnections and Assembly -- $t 9Fundamentals of Embedded and Fan-Out Packaging -- $t 10 Fundamentals of 3DPackaging with and without TSV -- $t 11 Fundamentals of RF and Millimeter-WavePackaging -- $t 12 Fundamentals of Optoelectronics Packaging -- $t 13Fundamentals of MEMS and Sensor Packaging -- $t 14 Fundamentals of PackageEncapsulation, Molding, and Sealing -- $t 15 Fundamentals of Printed WiringBoards -- $t 16 Fundamentals of Board Assembly -- $t Part 2 Applications ofPackaging Technologies -- $t 17 Applications of Packaging Technologies inFuture Car Electronics -- $t 18 Applications of Packaging Technologies inBioelectronics -- $t 19 Applications of Packaging Technologies inCommunication Systems -- $t 20 Applications of Packaging Technologies inComputing Systems -- $t 21 Applications of Packaging Technologies in FlexibleElectronics -- $t 22 Applications of Packaging Technologies in Smartphones -- $t Index.
650 0 $a Microelectronic packaging. $3 182088
700 1 $a Tummala, Rao R., $d 1942- $3 257663