國立高雄大學圖資館 |

登入

回首頁

Ultra-thin sensors and data conversion techniques for hybrid system-in-foil

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Ultra-thin sensors and data conversion techniques for hybrid system-in-foilby Mourad Elsobky.
作者:	Elsobky, Mourad.
出版者:	Cham :Springer International Publishing :2022.
面頁冊數:	xxi, 139 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer Nature eBook
標題:	Thin film devices.
電子資源:	https://doi.org/10.1007/978-3-030-97726-9
ISBN:	9783030977269$q(electronic bk.)

Ultra-thin sensors and data conversion techniques for hybrid system-in-foil
Elsobky, Mourad.

Ultra-thin sensors and data conversion techniques for hybrid system-in-foil[electronic resource] /by Mourad Elsobky. - Cham :Springer International Publishing :2022. - xxi, 139 p. :ill. (some col.), digital ;24 cm. - Springer theses,2190-5061. - Springer theses..

Motivation -- Introduction to Hybrid System-in-Foil -- O-Chip/On-Foil Passive and Active Components.

This book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips. The core of the work is on showing how to combine high-performance integrated circuits with large-area electronic components on a single polymeric foil, to realize smart electronic systems for different applications, such as temperature, humidity and mechanical stress sensors. The book offers an extensive introduction to Hybrid System-in-Foil technology (HySiF), and related on-chip/on-foil passive and active components. It presents six case studies designed to highlight key HySiF challenges, together with the methodology to address those challenges. Last but not least, it describes the development of a reconfigurable, energy-efficient Analog-to-Digital Converter for HySiF. All in all, this book provides readers with extensive information on the state of the art in the design and characterization of integrated circuits and hybrid electronic systems on flexible polymeric substrates. By describing significant advances in organic thin-film transistor technology, this work is expected to pave the way to future developments in the area of energy-efficient smart sensors and integrated circuits.

ISBN: 9783030977269$q(electronic bk.)

Standard No.: 10.1007/978-3-030-97726-9doiSubjects--Topical Terms:

219809
Thin film devices.

LC Class. No.: TK7872.T55 / E57 2022

Dewey Class. No.: 621.38152

Ultra-thin sensors and data conversion techniques for hybrid system-in-foil
LDR:02444nmm a2200337 a 4500 001 622876
003 DE-He213
005 20220318113850.0
006 m d
007 cr nn 008maaau
008 221209s2022 sz s 0 eng d
020 $a 9783030977269$q(electronic bk.)
020 $a 9783030977252$q(paper)
024 7 $a 10.1007/978-3-030-97726-9 $2 doi
035 $a 978-3-030-97726-9
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7872.T55 $b E57 2022
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.38152 $2 23
090 $a TK7872.T55 $b E49 2022
100 1 $a Elsobky, Mourad. $3 924884
245 1 0 $a Ultra-thin sensors and data conversion techniques for hybrid system-in-foil $h [electronic resource] / $c by Mourad Elsobky.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2022.
300 $a xxi, 139 p. : $b ill. (some col.), digital ; $c 24 cm.
490 1 $a Springer theses, $x 2190-5061
505 0 $a Motivation -- Introduction to Hybrid System-in-Foil -- O-Chip/On-Foil Passive and Active Components.
520 $a This book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips. The core of the work is on showing how to combine high-performance integrated circuits with large-area electronic components on a single polymeric foil, to realize smart electronic systems for different applications, such as temperature, humidity and mechanical stress sensors. The book offers an extensive introduction to Hybrid System-in-Foil technology (HySiF), and related on-chip/on-foil passive and active components. It presents six case studies designed to highlight key HySiF challenges, together with the methodology to address those challenges. Last but not least, it describes the development of a reconfigurable, energy-efficient Analog-to-Digital Converter for HySiF. All in all, this book provides readers with extensive information on the state of the art in the design and characterization of integrated circuits and hybrid electronic systems on flexible polymeric substrates. By describing significant advances in organic thin-film transistor technology, this work is expected to pave the way to future developments in the area of energy-efficient smart sensors and integrated circuits.
650 0 $a Thin film devices. $3 219809
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
650 2 4 $a Electronic Circuits and Systems. $3 913394
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer Nature eBook
830 0 $a Springer theses. $3 557607
856 4 0 $u https://doi.org/10.1007/978-3-030-97726-9
950 $a Engineering (SpringerNature-11647)